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Home   •   Spotlight  •  rlist2q06p  •  Most Requested Patent Families 2Q06-Chemistry and Related (8)
Most Requested Patent Families 2Q06-Chemistry and Related
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Following is one of the patent documents most requested by researchers using CAS electronic products.



CAS indexed 52 chemical substances from this document.
CAS subject entries for this document include: Polymerization; Polymerization catalysts; Polyacetylenes, uses; and 6 additional concepts.

CAPLUS COPYRIGHT 2006 ACS on STN

TITLE: Polymeric materials via click chemistry
INVENTOR(S): Fokin, Valery; Finn, M. G.; Sharpless, K. Barry
PATENT ASSIGNEE(S): The Scripps Research Institute, USA
SOURCE: PCT Int. Appl., 59 pp. CODEN: PIXXD2
LANGUAGE: English
PATENT INFORMATION:
PATENT NO.          KIND   DATE        APPLICATION NO.        DATE
---------------     ----   --------    --------------------   --------
WO 2006012569 A1 20060202 WO 2005-US26177 20050722 W: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW RW: AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR, BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG, BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW, AM, AZ, BY, KG, KZ, MD, RU, TJ, TM

ABSTRACT:
Adhesive polymers are formed when polyvalent azides and polyvalent alkynes are assembled into crosslinked polymer networks by copper-catalyzed 1,3-dipolar cycloaddn. The condensation polymn. is efficiently promoted by Cu ions either leached from the metal surface or added to the monomer mixt., and strong interactions with metal surfaces are provided by the multiple triazole binding elements produced. The adhesive polymers may be formed either as adhesive polymer coatings or as adhesive polymer cement. A typical adhesive for bonding Cu plates was based on THF contg. 2,2-bis(azidomethyl)-1,3-propanediol and N(CH2C.tplbond.CH)3 in a N3-C.tplbond.CH mol ratio 1:1.

 

Updated 5/8/2007 1:28:27 PM
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